Development of a capacitance sensor with interdigitated electrodes to monitor the curing process of EMCs

Besi Netherlands B.V. is part of the international and listed BESI (www.besi.com) and develop and produce machines for the semiconductor industry. Besi’s customers are worldwide leading producers of chips and their suppliers. Besi employs around 2000 people worldwide. The Duiven location employs around 150 people.

Thermosetting epoxy molding compounds (EMCs) are used to encapsulate chips against moisture and mechanical and thermal stress coming from the environment. As the EMCs melt and flow into the cavity, they undergo different chemical cross-linking reactions and form solid again.

Inline melt and cure monitoring during transfer molding of EMCs is essential for improving molding quality and  roductivity. Dielectric analysis (DEA) is one of the promising methods to reflect the degree of curing (DoC) of the EMCs during the process. This project aims to develop a capacitive sensor-based inline measurement setup to monitor the curing process of EMCs.

Assignment

The student will perform the assignment at ECTM and BESI BV in Duiven

• Duration: 9~12 months.
• Location: EKL cleanrooms and facilities.

In this project, you are expected to do the following things:

• Fabrication of the designed devices in ECTM cleanroom facilities.
• Building a dielectric analysis setup.
• Inline DoC monitoring with the test rig in BESI.
• A well-written thesis.

Requirements

The candidate should:

• Have a good understanding of microfabrication.
• Have a good understanding of electrical characterization.
• Be a team player as well as an independent researcher.

Contact

Last modified: 2024-07-15